SMTS Process Engineer RDA /Metrology

at Micron Technology, Inc. in Boise, Idaho, United States

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory-ready processes, working hands-on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, youll feel right at home here!

This role is a senior Process Engineering Technical Leader focused on chip-to-wafer and hybrid bonding. Youll lead the development and scale-up of bonding processes that enable high-performance 3D memory products like HBM and 3DS DRAM . Your work will span early pathfinding through high-volume manufacturing, with a clear impact on reliability, performance, and cost.

Responsibilities:

+ Set technical direction for chip-to-wafer and hybrid bonding processes across development programs

+ Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs

+ Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions

+ Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs

+ Drive technology transfer into manufacturing with a focus on repeatability and high-volume readiness

Minimum Qualifications:

+ Masters degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field

+ 13+ years of semiconductor R&D experience, including 10+ years in advanced packaging

+ Ability to lead multi-team technical efforts and drive decisions without formal authority

Preferred Qualifications:

+ Experience leading FOAK process or equipment development under technical uncertainty

+ Hands-on work with equipment and materials suppliers shaping next-generation capabilities

+ Demonstrated technical leadership through mentoring, methodology development, patents, or publications

+ Deep expertise in bonding processes such as solder reflow, TCB , and hybrid bonding

+ Strong understanding of process and package integration and cross-module interactions

As a world leader in the semiconductor industry, Micron is dedicated to your per